INNER LAYER PROCESS

1. Material Preparation- Shear material for job: Panel size, quantity and type of material, log laminate
   manufacturer and lot #.
2. Register Material- Drill tooling holes for inner layer registration.
3. Clean for Photo- Clean copper surface before laminating resist.
4. Laminate etch resist- Coat layers with etch resist.
5. Print Image- Expose image onto layers.
6. Develop Image- Chemically develop image.
7. Inspect Image- Visually inspect imaged layers.
8. Etch- Chemically etch image into copper surface of layer.
9. Strip Resist- Removes etch resist.
10. Inspect 100%- Visually inspect layers after etch.
11. Oxide layers- Oxide treat copper surfaces for corrosion prevention, and to enhance bonding at lamination.
12. Laminate Multi-Layers- Put layers and bonding material into fixture and press at temperature, pressure, and time required by the type of material.

HARD BOARD PROCESS

1. Material Prep- Shear material for job; Panel size, quantity and type of material, log laminate manufacturer and lot # on traveler, not necessary for multi-layers.
2. N/C Drill- N/C drill panels or multi-layers flat per drill card and job traveler.
3. Drill Inspect- Inspect drilled panels.
4. Deburr- Sand panels to remove any burrs.
5. Desmear/Etchback- Multi-layers only. Removes epoxy smear caused by drilling from inner layer interconnects, and conditions exposed glass fibers.
6. Sensitize- Chemically coats drilled hole wall with a conductive palladium deposit.
7. Clean for Photo- Clean copper before laminating resist
8. Laminate plating resist- Coat panels with plating resist.
9. Image- Expose image onto panels.
10. Develop- Chemically develop image.
11. Image Inspect- Visually inspect imaged panels.
12. Pattern Plate- Plate copper and tin/lead onto imaged panel.
13. Strip Resist- Removes plating resist.
14. Etch Inspect- Visually inspect panels before etch.
15. Etch- Chemically etch copper from panels.
16. Oil Fuse- Thermally alloys tin/lead plate for a reflowed solder deposit.
17. Nickel/Gold Plate- Plate nickel/gold tabs if required
18. Pre-Mask Inspect- 100% Visual Inspection
19. Screen Soldermask- Screen solder mask on panels. Traveler specifiecies type of mask, photo imageable or
    wet mask.
20. Screen letter screen- Screen letter screen on panels. Traveler specifies color of letter screen, white, yellow, or black.
21. Rout- N/C Rout parts to customers specification.
22. Bevel/Slot Tabs- Bevel/Slot Tabs per print
23. Electrical Test- Electrically test parts (outside service, only done if required by customer).
24. Final Inspection- Inspect 100% for conformity to all customer specifications.
25. Package and Ship- Ship per customer requirements.